Mun himmatu wajen haɓaka dandamali na CAE / CFD na gida da software na dawo da samfurin 3D, ƙware a samar da simintin dijital da mafita don haɓaka ƙira, rage yawan amfani da makamashi da hayaki, da rage farashin da haɓaka haɓakawa ga filayen kamar biomedicine da watsa cututtuka, masana'antar kayan ƙima, injiniyan tsafta, cibiyoyin bayanai, adana makamashi da sarrafa masana'antu mai nauyi, da kuma sarrafa zafin jiki.
A cikin manyan masana'antun masana'antu kamar masana'antar semiconductor, biomedicine, da madaidaicin na'urorin gani, ƙaramin ƙurar ƙura ɗaya na iya haifar da duk tsarin samarwa ya gaza. Bincike ya nuna cewa a cikin hadadden guntu guntu, kowane karuwa na 1,000 barbashi/ft³ na ƙurar barbashi da ya fi girma fiye da 0.3μm yana ƙara ƙimar lahani guntu da kashi 8%. A cikin samar da magunguna marasa kyau, matakan ƙwayoyin cuta masu yawo da yawa na iya haifar da zubar da samfuran duka. Dakin tsafta, ginshiƙin masana'anta na zamani mai tsayi, yana kiyaye inganci da amincin samfuran sabbin abubuwa ta hanyar daidaitaccen kulawar ƙananan matakan. Fasahar simintin simintin ƙididdiga ta ruwa mai ƙima (CFD) tana canza ƙirar ɗaki na gargajiya da hanyoyin ingantawa, zama injin juyin juyi na fasaha a aikin injiniyan ɗaki mai tsabta. Masana'antar Semiconductor: Yaƙin Ƙarar Ƙarar Ƙira. Masana'antar guntu Semiconductor ɗaya ce daga cikin filayen da ke da ƙaƙƙarfan buƙatun ɗaki mai tsafta. Tsarin photolithography yana da matukar damuwa ga barbashi ƙanana kamar 0.1μm, yana mai da waɗannan ɓangarorin ultrafine kusan ba zai yiwu a iya gano su tare da kayan ganowa na gargajiya ba. A 12-inch wafer fab, yin amfani da high-yi Laser ƙura gano barbashi gano da kuma ci-gaba da fasaha mai tsabta, samu nasarar sarrafa maida hankali juzu'i na 0.3μm barbashi zuwa cikin ± 12%, yana ƙaruwa samfurin da 1.8%.
Biomedicine: The Guardian of Bacterial Production
A cikin samar da magunguna marasa lafiya da alluran rigakafi, ɗakin tsafta yana da mahimmanci don hana gurɓataccen ƙwayoyin cuta. Tsaftataccen dakin gwaje-gwaje ba wai kawai yana buƙatar ƙididdige adadin barbashi ba amma har ila yau yana kula da yanayin zafin da ya dace, zafi, da bambance-bambancen matsa lamba don hana kamuwa da cuta. Bayan aiwatar da tsarin tsaftar daki mai hankali, mai yin alluran rigakafin ya rage daidaitaccen karkatacciyar ƙididdige adadin barbashi da aka dakatar a cikin yankin Class A daga barbashi 8.2/m³ zuwa 2.7 barbashi/m³, yana rage sake zagayowar takardar shaidar FDA da kashi 40%.
Jirgin sama
Daidaitaccen mashin ɗin da haɗa abubuwan haɗin sararin samaniya yana buƙatar yanayin ɗaki mai tsabta. Misali, a cikin injin injin injin jirgin sama, ƙananan ƙazanta na iya haifar da lahani a sama, suna tasiri aikin injin da aminci. Haɗin kayan aikin lantarki da kayan aikin gani a cikin kayan aikin sararin samaniya kuma yana buƙatar yanayi mai tsabta don tabbatar da aiki mai kyau a cikin matsanancin yanayi na sarari.
Ingantattun Injinan da Kera kayan aikin gani
A cikin mashin daidaitaccen mashin, irin su samar da motsi na agogo mai tsayi da tsayin daka mai mahimmanci, ɗakin tsafta na iya rage tasirin ƙura akan madaidaicin abubuwan da aka gyara, inganta daidaiton samfur da rayuwar sabis. Ana iya yin ƙera da haɗar kayan aikin gani, kamar ruwan tabarau na lithography da ruwan tabarau na hangen nesa na taurari, a cikin yanayi mai tsabta don hana lahani na sama kamar karce da rami, tabbatar da aikin gani.
Fasahar Kwaikwayo ta CFD: "Kwakwalwar Dijital" na Injiniyan Tsabtace
Fasahar simintin simintin ƙididdiga ta ruwa (CFD) ta zama babban kayan aiki don ƙirar ɗaki mai tsabta da haɓakawa. Yin amfani da hanyoyin bincike na ƙididdigewa don tsinkayar kwararar ruwa, canja wurin kuzari, da sauran halayen jiki masu alaƙa, yana haɓaka aikin tsafta sosai. Fasahar CFD don haɓaka kwararar iska na iya kwaikwayi jigilar iska mai tsabta da haɓaka wuri da ƙira na samarwa da dawo da iskar iska. Wani bincike ya nuna cewa ta hanyar tsara wurin da kyau da kuma dawo da tsarin iska na raka'o'in tace fan (FFUs), ko da tare da rage yawan matatun hepa a ƙarshe, ana iya samun ƙimar tsafta mafi girma yayin samun babban tanadin makamashi.
Abubuwan Ci gaba na gaba
Tare da nasarorin da aka samu a fannoni kamar ƙididdigar ƙididdiga da biochips, buƙatun tsabta suna ƙara tsauri. Samar da jimla bit har ma yana buƙatar ajin ISO Class 0.1 mai tsafta (watau, girman barbashi ≤1 a kowace mita cubic, ≥0.1μm). Wuraren tsabta na gaba za su samo asali zuwa mafi girman tsabta, mafi girman hankali, da ɗorewa mafi girma: 1. Haɓaka Haɓakawa: Haɗa algorithms AI don tsinkayar abubuwan tattarawar barbashi ta hanyar koyo na na'ura, da sauri daidaita ƙarar iska da tace hawan keke; 2. Aikace-aikacen Twin na Dijital: Gina tsarin tsarin taswirar dijital mai tsabta mai girma uku, tallafawa binciken nesa na VR, da rage farashin ƙaddamarwa na ainihi; 3. Ci gaba mai dorewa: Yin amfani da ƙananan refrigerants, samar da wutar lantarki ta hasken rana, da tsarin sake amfani da ruwan sama don rage hayakin carbon har ma da cimma "ɗakin tsabtace sifili-carbon".
Kammalawa
Fasahar ɗaki mai tsafta, a matsayin mai kula da ganuwa na masana'anta na ƙarshe, yana ci gaba da haɓaka ta hanyar fasahar dijital kamar kwaikwaiyon CFD, yana ba da ingantaccen yanayin samarwa mai tsabta kuma mafi aminci don ƙirƙira fasaha. Tare da ci gaba da ci gaban fasaha, ɗakin tsafta zai ci gaba da taka rawar da ba za a iya maye gurbinsa ba a cikin ƙarin fagage masu tsayi, yana kiyaye kowane micron na sabbin fasahohi. Ko masana'antar semiconductor ce, biomedicine, ko masana'anta na gani da daidaiton kayan aikin, haɗin gwiwa tsakanin ɗakin tsafta da fasahar kwaikwaiyon CFD zai fitar da waɗannan filayen gaba da ƙirƙirar ƙarin mu'ujizar kimiyya da fasaha.
Lokacin aikawa: Satumba-18-2025